961 results
MICROFAB® SPM-1100
Copper plating solution provides superior coplanarity in a low KV system and exceptional uniformity.
Learn moreMICROFAB® SN-350
Low-alpha pure tin plating process enables high-speed electro-deposition of smooth, fine-grained, uniform tin bumps.
Learn moreMICROFAB® Pure BP
Pure copper process with high KV resistance, engineered for copper pillar, copper stud and Under-Bump Metallization (UBM) applications.
Learn moreMICROFAB® AU660
Mild alkaline non-cyanide gold electroplating process for backside interconnects (via liners) and fine pitch pattern gold bumping.
Learn moreNickel Solutions
Nickel sulfamate processes, including boric acid-free options, produce pure, ductile, fine-grained, matte, low-stress deposits.
Learn moreNOVAFAB® Pd Acid Strike
Pure palladium acid pre-plate delivers thin Pd deposits for a wide range of current densities and electroplating conditions, specifically optimized for FOWLP solder surfaces.
Learn moreNOVAFAB® HPM-500
High-performance copper process provides superior coplanarity and exceptional within-die, and within-feature uniformity.
Learn moreNOVAFAB® VIA FILL AU
Industry-leading cyanide-, arsenic-, thallium- and lead-free gold process capable of via filling with low surface roughness.
Learn moreMICROFAB® AU660
Mild alkaline, non-cyanide gold electroplating process for MEMS, ideal for backside interconnects (via liners) and fine-pitch pattern gold bumping with superior coverage.
Learn moreBDT-510
A trusted alkaline, non-cyanide electroplating system for MEMS, delivering bright, ductile gold deposits with exceptional purity and ease of use.
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