961 results
Innolot® Power Electronics
SAC-based formulation designed in collaboration with the automotive industry for high-temperature and vibration environments.
Learn moreATROX® 558-2C31
The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements.
Learn moreATROX® 800HT2VX
PFAS-free, conductive die attach products deliver a cost-effective, high-performance solution, leading the way in advanced materials.
Learn moreALPHA® Argomax® 2040 Paste
High-performance silver sintering paste engineered for top attach and die bonding applications.
Learn moreLow Alpha Tin
Anode and acid-based replenishers that deliver improved reliability and supply chain assurance with locally sourced Low Alpha Tin.
Learn moreNOVAFAB® NANOTWIN Cu
A high-purity copper electroplating process formulated for fabricating pillars or pads for hybrid bonding applications.
Learn moreNOVAFAB® Fine Grain Copper
Award-winning advanced electroplating process producing a unique, ultra-pure, copper film for hybrid bonding applications.
Learn moreMICROFAB® RDLV Series
Acid copper plating system designed for simultaneous plating of RDL lines and via filling across a wide range of geometries.
Learn moreMICROFAB® TS-650 NXG
Tin-silver bump metallization bath allows high-speed electro-deposition of smooth, fine-grained, uniform tin silver alloy bumps.
Learn moreMICROFAB® MP-2500
High-speed copper plating process provides exceptional Within-Die and Within-Feature uniformity for mega pillar applications.
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