961 results

STAYSTIK® 472

A thermoplastic adhesive film that bonds at low temps with a low modulus (60,000 psi).

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STAYSTIK® 181

Silver-filled thermoplastic paste offers strong bonding for electronics, ideal for MCMs, and superior reworkability.

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STAYSTIK® 482

Thermoplastic adhesive film excels in electronics, offering strong bonding for MCMs and better reworkability than thermosets.

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STAYSTIK® 581

Silver-filled conductive film offers strong bonding for MCMs and superior reworkability compared to thermosets.

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ALPHA® Argomax® 8020 Film

Sinter silver film for die and spacer lamination on silver surfaces, using pick-and-place equipment.

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STAYSTIK® 682

Aluminum nitride-filled thermoplastic film for electronics, offering strong bonding for MCMs and reworkability.

 

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POLYSOLDER® SE3001

Conductive adhesive cures with Infrared (IR), convection, conduction, or vapor phase. Fast, low-temp curing, stable, reliable contact.

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ALPHA® Argomax® 2040 Paste

A silver sintering die attach paste for placing dies on wet paste (before drying) and then performing low-pressure sintering.

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ALPHA® Argomax® AccuLam™ 8022 Film

High-reliability silver sinter pre-cut film with a pure silver bond line, offering excellent thermal/electrical conductivity on Ag/Au.

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ALPHA® Argomax® 2141 Paste

A silver sinter paste for large packages, designed for high-tack component placement on wet paste for marginal surfaces.

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