961 results
ALPHA® NCX-402-M3 Flux
No-clean paste flux that enables low residue post reflow with low voiding and excellent soldering performance.
Learn moreALPHA® WS-698 Flux
Water-soluble, high-activity paste flux that offers excellent wetting on tough finishes and low voiding performance.
Learn moreALPHA® HiTech® AD13-9521B
A single-component epoxy cures at low temperatures, offering water resistance and bonding FPCB to various plastic materials.
Learn moreALPHA® HiTech® AD13-9692B
A single-component epoxy system ideal for bonding heat-sensitive devices and designed for camera module applications.
Learn moreALPHA® HiTech® UP44-5566T
A UV-curing system, suitable for rapid curing and bonding in diverse applications, including coating and component fixing.
Learn moreSTAYDRY® H2-3000PSA
Film with a unique getter, hydrogen absorber, and desiccant for water control in a flexible silicone matrix.
Learn moreENTHONE Catalysts
Extends ink pot life from 1 to 24 hours. Check post-cure: conductivity, resistance, outgassing, and chemical/moisture resistance.
Learn moreSTAYSTIK® 336T
Solvent-based adhesive for temporary bonding, ideal for GaAs/silicon wafer thinning. Debonds with IPA, no residue.
Learn moreSTAYSTIK® 672
Aluminum nitride-filled adhesive film for electronics bonds well at low temps, handles different TCEs, and is reworkable.
Learn moreSTAYSTIK® 571
Silver-filled conductive film bonds well at low temps (60,000 psi modulus), handles different CTEs, and is easily reworked.
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