961 results

Electrolube® LGF400 Liquid Gap Filler

A two-component, 4W/m-K cure-in-place thermal interface material formulated for demanding thermal transfer and scalable production requirements.

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ALPHA® Vaculoy® Solid Solder

Pure, low-dross, high-fluidity solder alloy.

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STAYDRY® H2-3000

A specialized getter with an active hydrogen absorber and desiccant in a flexible silicone matrix for water absorption.

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ENTHONE M-Series Inks

Extends ink pot life from 1 to 24 hours. Assess post-cure: conductivity, resistance, outgassing, and chemical/moisture resistance.

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Kester® OR-421 Flux Cored Wire

A high activity, water-soluble, flux-cored solder wire.

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Kester® AW Flux Cored Solder Wire

An extremely active inorganic acid flux for industrial soldering applications where a flux-cored solder wire is preferred. 

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ENTHONE 50-Series Inks

Two-part permanent inks for circuit board legends and markings, available in a wide variety of colors.

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ALPHA® HRL3 Solid Solder

A low-temperature lead-free alloy designed to exhibit improved thermomechanical reliability and soldering performance.

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NOVAFAB® AG-340

Cyanide-free silver electroplating process optimized for Micro-Electromechanical Systems (MEMS) wafer plating applications.

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Kester® OR-421 Flux Cored Wire

A high-activity, water-soluble flux-cored solder wire engineered for reliable electronics and industrial soldering applications.

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