961 results
M-Speed HF
Low-etch oxide alternative coating provides low surface profiles and reliable adhesion for high-frequency applications.
Learn moreKester® InAg sTIM
A sintered indium-silver thermal interface material designed for high-performance semiconductor applications.
Learn moreATROX® 850HT1
Conductive die attach pastes offer excellent performance to meet today's high reliability standards.
Learn moreATROX® 800HT7A
An ultra-low stress Hybrid Silver sintered die attach paste with high thermal conductivity set for high power exposed pad semiconductors.
Learn moreATROX® 800HT2V
A thermosetting conductive die attach with very high thermal conductivity designed for high power semiconductor packages.
Learn moreATROX® 800HT6B
Ultra-low stress, thermally conductive die attach for high-power, exposed pad semiconductor applications.
Learn moreATROX® 590-4HT1
Low-stress, thermally conductive die attach adhesive for high-power and exposed pad semiconductor packages.
Learn moreElectrolube® LGF200 Liquid Gap Filler
A two-component, cure-in-place thermal interface material formulated for high-volume production.
Learn moreALPHA® Vaculoy® SAC305, 387, 405 Solid Solder
High-silver, lead-free alloys for wave and selective soldering.
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