961 results
M-Copper Omega®
High-dep metallization process combining a patented activation sequence with a statistically designed electroless copper bath.
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ALPHA® AccuFlux® Solder Preforms-Power Electronics
Solder Preforms with Embedded Bond Line Control
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Lead-free, high temperature, high reliability alloys targeting Power Electronics applications
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High lead solder preforms with 4N alloy purity for die attach.
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Advanced leadframe adhesion technology designed to overcome delamination problems to achieve MSL-1 reliability.
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Low-etch alternative oxide provides low surface profiles and reliable adhesion for high frequency applications.
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High-reliability, two-component polyurethane conformal coating for demanding applications.
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A water-based lacquer designed to protect specific areas of film during processing. Easily removable.
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Windotex™
Windotex produces clear and durable display windows when selectively printed on Autotex textured films.
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A flexible hardcoated film with a smooth texture designed for laptop touchpads.
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