961 results
MacuSpec™ AVF Series
Advanced via fill copper metallization processes for high-density interconnects.
Learn morePC 600
Pulse plating process that delivers precise thickness uniformity and productivity unattainable by conventional acid copper plating.
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Sterling®
Delivers exceptional solder joint strength, touchpad functionality, wire bondability, and in-circuit test compatibility.
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MacStan HSR 3.0
Immersion tin plating process inhibits whisker formation and delivers tin deposits with an extended shelf life of up to 12 months.
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Dolphin
Upgraded immersion tin process enables higher throughput, less downtime, and smaller equipment footprints.
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Advanced DC acid copper pattern plating specifically formulated to plate fine lines and pads in embedded trace substrates.
Learn moreEnvision®
Environmentally friendly, polymer-based system that delivers high performance and production capacity.
Learn moreEnklad Zincate 100/100R
Alkaline zincating solution designed for electroless nickel plating of aluminum alloys used in memory disk manufacturing.
Learn moreEnklad Cleaner-Etch 100
One-step acidic soak cleaner/etchant formulated to provide superior cleaning and etching for aluminum alloy substrates.
Learn moreM-System
Integrated desmear–electroless copper system designed to plate pure, smooth, dense and uniform copper deposits.
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