Product Overview

MICROFAB TS-650 NXG Tin Silver bump plating bath is an organic sulfonate-based electrolyte, for high speed electro-deposition of smooth fine-grained, uniform Tin Silver alloy bumps. It is designed for lead-free and capping applications and provides exceptional within-wafer (WIW), within-die (WID), and within-feature uniformity.

Features

  • Low temp solder
  • Low alpha
  • Smooth deposit
  • Excellent coplanarity
  • Low surface roughness
  • High speed

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Sales Sheet
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MICROFAB TS-650 NXG Sales Sheet English

Designed for a wide range of Flip Chip, FOWLP, 2.5D/3D bumping applications.

MICROFAB TS-650 NXG is designed for a wide range of Flip Chip, FOWLP, 2.5D/3D bumping applications with higher plating speeds. It is a MSA- Based Tin Silver process combined with a three-part additive system.

Plating Solder-Macdermid Alpha
Plating Solder-Macdermid Alpha

Designed for C4 Bump (Mushroom, In-Via), mBump and capping applications

MICROFAB TS-650 NXG is designed for C4 Bump (Mushroom, In-Via), mBump and capping applications. MICROFAB TS-650 NXG has a smooth as plated deposit morphology, excellent Ag% control and uniformity.

Excellent WID / WIW Height Uniformity.

MICROFAB TS-650 NXG is void free post reflow and has excellent WID / WIW height uniformity. It exhibits high stability and resist compatibility with a wide process window allowing deposition rates of 6 -15 ASD.

Plating Precious Metal-Macdermid Alpha

MICROFAB TS-650 NXG

Product Name

Solder Type

Surface Type

Peformance Feature

EHS

MICROFAB TS-650 NXG

Sn/Ag – Tin Silver
Low Alpha
Ultra-low Alpha

Smooth Deposit
Excellent Coplanarity
Low Surface Roughness

Hybrid CD leveling
High Speed
Excellent Alloy Distribution

Lead-Free

Key Barrier Materials, Latest Solder Bumps / Caps Offerings and Copper Solutions.

MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB SN-350 MICROFAB RDLV 50, 60, 70 MICROFAB MP 2500 MICROFAB SPM 1100 MICROFAB SC 40

Key Barrier Materials, Latest Solder Bumps / Caps Offerings and Copper Solutions.

MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB SN-350 MICROFAB RDLV 50, 60, 70 MICROFAB MP 2500 MICROFAB SPM 1100 MICROFAB SC 40

Pure Tin Solder Capping for Copper Pillars where Ease of Use is Key

MacDermid Alpha’s pure tin has been BKM at tool OEM’s and compound semiconductor for more than a decade. Pure Sn ease of use and lack of alloy to control worries lends itself well to memory and pitch size reductions.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Pure Tin Solder Capping for Copper Pillars where Ease of Use is Key

MacDermid Alpha’s pure tin has been BKM at tool OEM’s and compound semiconductor for more than a decade. Pure Sn ease of use and lack of alloy to control worries lends itself well to memory and pitch size reductions.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Total Pillar Capability

MacDermid Alpha’s pure tin is just a portion of our total pillar solution. Best in class copper pillar, RDL chemistries combined with nickel barrier and solder solutions enables one stop high reliability, high yield products.

UBM Wafer Bumping Pillar / Post RDL

Total Pillar Capability

MacDermid Alpha’s pure tin is just a portion of our total pillar solution. Best in class copper pillar, RDL chemistries combined with nickel barrier and solder solutions enables one stop high reliability, high yield products.

UBM Wafer Bumping Pillar / Post RDL

Key Barrier Materials, Latest Solder Bumps / Caps Offerings and Copper Solutions.

MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB SN-350 MICROFAB RDLV 50, 60, 70 MICROFAB MP 2500 MICROFAB SPM 1100 MICROFAB SC 40

Key Barrier Materials, Latest Solder Bumps / Caps Offerings and Copper Solutions.

MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB SN-350 MICROFAB RDLV 50, 60, 70 MICROFAB MP 2500 MICROFAB SPM 1100 MICROFAB SC 40

Pure Tin Solder Capping for Copper Pillars where Ease of Use is Key

MacDermid Alpha’s pure tin has been BKM at tool OEM’s and compound semiconductor for more than a decade. Pure Sn ease of use and lack of alloy to control worries lends itself well to memory and pitch size reductions.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Pure Tin Solder Capping for Copper Pillars where Ease of Use is Key

MacDermid Alpha’s pure tin has been BKM at tool OEM’s and compound semiconductor for more than a decade. Pure Sn ease of use and lack of alloy to control worries lends itself well to memory and pitch size reductions.

Wafer Level Packaging System in Package (SiP) Power Semiconductor Sensors Heterogeneous Integration

Total Pillar Capability

MacDermid Alpha’s pure tin is just a portion of our total pillar solution. Best in class copper pillar, RDL chemistries combined with nickel barrier and solder solutions enables one stop high reliability, high yield products.

UBM Wafer Bumping Pillar / Post RDL

Total Pillar Capability

MacDermid Alpha’s pure tin is just a portion of our total pillar solution. Best in class copper pillar, RDL chemistries combined with nickel barrier and solder solutions enables one stop high reliability, high yield products.

UBM Wafer Bumping Pillar / Post RDL
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