(South Plainfield, NJ USA) – April 7, 2022 – Kevin Martin, Regional Product Manager for SMT Solutions, will be one of the panelists in the upcoming Global SMT & Packaging discussion, “Head-in-Pillow - what causes it, how do you spot it and how do you avoid it?” on April 19 at 10:30 am New York / 3:30 pm London.
The industry continues to struggle with Head-in-Pillow (HiP) defects, especially as the density of component packages on boards continues to increase. Kevin Martin, Regional Product Manager for SMT Solutions, will be one of the industry experts participating in the panel which will discuss the causes, challenges, and possible solutions for mitigating this defect. The webinar will include a live Q&A session following the roundtable discussion.
Kevin Martin recently joined the MacDermid Alpha Electronics Solutions Assembly Division as Product Manager for SMT Solutions. In this role, he supports the development and implementation for the global strategy and management of the Alpha and Kester portfolios of industry leading solder pastes. Martin has over 10 years of experience in the electronics manufacturing industry in roles such as technical service, business development, and product management.
To register for the panel, please click here.