Latest Silver Sinter Technology Presented at the EPP Innovations Forum

Ralph Christ, Customer Technical Support Manager DACH Region at MacDermid Alpha will present Silver Sintering, the New Soldering? at the event and will discuss the silver sintering process and its benefits compared to traditional soldering processes, as well as highlighting MacDermid Alpha’s range of ALPHA® Argomax® silver sinter materials. “Silver Sintering is a proven technology that overcomes many of the thermal dissipation, power cycling and high temperature stability challenges associated with power module interconnects,” comments Ralph. “MacDermid Alpha’s range of ALPHA Argomax silver sinter technology products are designed to exceed the demanding quality and reliability standards of the power semiconductor industry.” ALPHA Argomax enables low pressure sintering die attachment based on highly engineered particles.

ALPHA Argomax creates extremely high thermal and electrical conductivity silver bonds with a high reliability and flexible bond line thickness. ALPHA Argomax is available in sinter paste, film and preform products suitable for Ag, Au and Cu surface finishes as well as challenging technologies such as Si, SiC and GAN die attach processes.

To register for the EPP Innovations Forum go to: https://epp.industrie.de/innovationsforum-deutschland/. Link here for more information on Alpha's sintering and power solutions.