News & Events
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha Electronics Solutions Celebrates 25 Years of Partnership with Distributor Lenz SP.j
The Assembly Division of MacDermid Alpha Electronics Solutions has celebrated 25 years of partnership with Lenz SP.j, its distributor of ALPHA brand products in Poland.
Assembly
Press Release
Sintering Process Solutions Introduced at PCIM Asia in China
The Assembly Solutions divisionwill introduce its sintering process solutions at PCIM Asia at the Shenzhen World Exhibition Center in Shenzhen, China from September 9-11, 2021.
Semiconductor
Press Release
Product Launch - MICROFAB® EVF NiBAR Boric Acid Free Electrolytic Nickel
MacDermid Alpha Electronics Solutions and electronics assembly announces the release of MICROFAB EVF NiBAR, a boric acid free sulfamate nickel electroplating process for semiconductor applications.
Assembly
Press Release
High Reliability Solutions Featured at SMTA Ohio Valley Expo & Tech Forum
The Assembly Division of MacDermid Alpha Electronics Solutions will exhibit at the SMTA Ohio Valley Expo & Tech Forum on Wednesday, August 25th at the Holiday Inn in Strongsville, Ohio.
Assembly
Press Release
Technical Paper Presented at SMTA China South Technical Conference 2021
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting a technical paper: “The Interaction of Two Solder Paste Alloys With 5 Surface Finishes” at the SMTA China South Technical Conference taking place from August 25 - 26 in Shenzhen, China.
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Latest Technology Offerings Promoted at the China International Electronics Circuit Exhibition
MacDermid Alpha Electronics Solutions will be exhibiting at the China International Electronics Circuit Exhibition hosted by the China Printed Circuit Association. The show will be held from July 7-9, 2021 at the National Exhibition and Convention Center in Shanghai.
Assembly
Press Release
Experts Present on Low Temperature Solder Solutions at Virtual Technical Conferences
MacDermid Alpha Electronics Solutions will present papers on low temperature solder technology and solutions at two upcoming virtual conferences, the Electronic Components and Technology Conference (ECTC) on June 7 and at the Low Temperaure Soldering (LTS) Conference 2021 being held on June 16.
Assembly
Press Release
Technical Presentation on "Advantages of Prefluxed Ribbon-wire in Multi-busbar Interconnection" at SNEC 2021 China
The Assembly Division of MacDermid Alpha Electronics Solutions will present the technical paper ‘Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection’ at the SNEC 15th (2021) International Photovoltaic Power Generation and Smart Energy Conference & Exhibition taking place in Shanghai, China on June 2-5, 2021.
Assembly
Press Release
Paper Presentation on Ultra-Low Temperature Solder for Flexible Hybrid Electronics at Virtual Conference
MacDermid Alpha Electronics Solutions will be presenting “Ultra-Low Temperature Solder for Flexible Hybrid Electronics” at the upcoming virtual conference on Printed, Hybrid, Structural and 3D Electronics event hosted by TechBlick on May 11 and 12, 2021.
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
MacDermid Alpha Electronics Solutions Announces the Acquisition of H. K. Wentworth Group
MacDermid Alpha Electronics Solutions, a leading global supplier of specialty chemicals and materials used in the semiconductor fabrication, semiconductor packaging, and printed circuit board fabrication and assembly markets announced today that it has acquired H.K. Wentworth Group, owner of the Electrolube & AF brands.
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Three Technical Papers Presented at SMTA China East Technical Conference 2021
The Assembly Division of MacDermid Alpha Electronics Solutions will present three technical papers: “High-Reliability, Fourth Generation Low-Temperature Solders: Improving Drop Shock Performance”, “Can Low Cost Silver-Free Alloys Be Used in Type II and III Assemblies?” and “Can All Liquid Fluxes Work Well on A Reflowed OSP Pad Finish?” at the SMTA China East Technical Conference taking place from April 21-22 in Shanghai, China.
Assembly
Press Release
Product Launch - ALPHA CVP-390V High Reliability Solder Paste for Harsh Operating Conditions
MacDermid Alpha Electronics Solutions announces the release of ALPHA CVP-390V high reliability solder paste, designed to maximize flexibility in manufacturing and provide excellent electrochemical reliability in harsh operating conditions.