News & Events


Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
New Ultra-Low Temperature Solder and 5G Solutions Launching at Productronica China 2020
The Assembly Solutions Division of MacDermid Alpha Electronics Solutions will introduce its new ultra-low temperature solder and 5G solutions at the Productronica China show from July 3-5, 2020, at the National Exhibition and Convention Center in Shanghai.

Assembly
Press Release
MacDermid Alpha to Host Automotive Electronics Assembly Solutions Customer Webinar
The Assembly Solutions division of MacDermid Alpha Electronics Solutions is hosting a free, online customer webinar on the topic of Automotive Electronics Assembly Solutions. The webinar will take place on Wednesday 24th June at 15:00pm CET with Paul Salerno, Portfolio Manager – SMT as presenter.

Circuitry
Press Release
Product Launch - Complete Semi-Additive Process for IC Substrates and Panel Level Packaging: Systek SAP
MacDermid Alpha Electronics Solutions announces the release of Systek SAP.

Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Technology Experts to Participate in Online Industry Panel Discussions
MacDermid Alpha Electronics Solutions will participate in two online panel discussions on Tuesday 2nd June; Recent Advances in Low Temperature Solders hosted by Global SMT & Packaging, and the SMT Printing Round Table hosted by the Surface Mount Technology Association (SMTA).

Assembly
Press Release
MacDermid Alpha to Host Series of Online Italian Customer Webinars
The Assembly Solutions Division is hosting a series of four free online webinars for Italian customers on key topics from Void Reduction to Low Temperature Assembly Solutions. The webinars will be hosted by MacDermid Alpha’s technology experts, in Italian language and will begin on Tuesday May 26th.

Assembly
Press Release
MacDermid Alpha Promotes ALPHA® SnCX Plus 07 Alloy as a New Solution for Moderately Complex Assemblies
The Assembly Solutions division promotes its ALPHA SnCX Plus 07 silver free and lead free wave solder alloy as a new solution for moderately complex assemblies.

Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
MacDermid Alpha Announces the Appointment of Rick Fricke as Vice President and General Manager of Semiconductor Solutions Division
MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces Rick Fricke will be joining MacDermid Alpha Electronic Solutions (MAES) as the Vice President and General Manager of their Semiconductor Solutions division.

Assembly
Press Release
Research Presentation on High-Reliability Alloys at SMTA Philadelphia Chapter Meeting
Jason Fullerton will present at the SMTA Philadelphia Chapter meeting being held on March 12th, 2020 at Lutron Electronics, Inc. in Coopersburg, Pennsylvania.

Assembly
Press Release
Latest Silver Sinter Technology Presented at the EPP Innovations Forum
The Assembly Solutions Division of MacDermid Alpha Electronics Solutions will present on the Silver Sintering Process at the EPP Innovations Forum on Thursday 5th March in Böblingen, Germany.

Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
MacDermid Alpha to Exhibit and Present at the Upcoming IMAPS Device Packaging Conference
MacDermid Alpha Electronics Solutions will exhibit total process solutions for emerging packaging at the IMAPS Conference, Fountain Hills, AZ, March 3-5, 2020.

Assembly
Press Release
MacDermid Alpha Announces New Distribution Partnership for the UK and Ireland
The Assembly Division of MacDermid Alpha Electronics Solutions is excited to announce a new distribution partnership with Advanced Manufacturing Services Limited (AMS) for the sale and distribution of Alpha brand products in the United Kingdom and Ireland, effective 1st April 2020.

Assembly
Press Release
ALPHA® OM-550 Solder Paste to be Demonstrated by Vermes Microdispensing at IPC APEX Conference & Expo 2020
MacDermid Alpha Electronics Solution will have its revolutionary low temperature solder paste, ALPHA OM-550 HRL1 demonstrated by Vermes Microdispensing on their latest solder paste jetting dispense system, MDS 1560 with DST(Dynamic Shockwave Technology), during this year’s IPC APEX Conference and Expo, February 1-6, in San Diego, California.