News & Events

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MacdermidAlpha-Market
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News_HiTech Cornerfill and Underfill_Product Release_2Sep2021
Assembly
Press Release
Product Launch - ALPHA HiTech High Tg, Low CTE Underfill & Cornerfill Bonding Materials
The Assembly Division announces the release of ALPHA HiTech Underfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.
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News_Alpha OM-372_Product Release_2Sep2021
Assembly
Press Release
Product Launch - New Innovative Solder Paste Enabling Next Generation High Density Assembly Designs
MacDermid Alpha Electronics Solutions is pleased to launch ALPHA OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.
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News_IECE HKPCA 20_31Aug2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Latest Technology Offerings Promoted at the International Electronics Circuit Exhibition
MacDermid Alpha Electronics Solutions will be exhibiting at the International Electronics Circuit Exhibition hosted by the Hong Kong Printed Circuit Association. The show will be held from December 2-4, 2020 at the Shenzhen Convention and Exhibition Center, China.
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News_Heliofab AG 7921_Product Release_2Sep2021
Circuitry
Press Release
Product Launch - HELIOFAB AG 7921 High-Brightness Silver for Leadframe Based LED Packages
MacDermid Alpha Electronics Solutions announces the release of MacuSpec VF-TH 300, a new addition to the award-winning VF-TH series electroplating processes widely utilized in mSAP HDI manufacturing.
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Image of printed circuit board
Assembly
Press Release
MacDermid Alpha Offers Full Line of Environmentally Friendly, REACH Compliant Soldering Products
In line with the latest REACH Annex XIV regulations banning the use of Nonylphenol Ethoxylate (NPE) and Octylphenol Ethoxylate (OPE) based surfactants due to come into effect in Europe on the 4th January 2021, MacDermid Alpha is ready to offer customers soldering products that ensure compliance to the regulation.
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News_PCIM Asia 20_31Aug2021
Assembly
Press Release
Presentation on Power Package Attach by Silver Sintering at PCIM Asia Conference
The Assembly Division will be presenting the paper, “Power Package Attach by Silver Sintering – Process, Performance & Reliability“ at the PCIM Asia Conference 2020 which will take place from November 16-18 in Shanghai, China.
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MAES
Assembly
Press Release
Sintering Products Introduced at the Step-by-Step Technical Conference in China
The Assembly Division of MacDermid Alpha Electronics Solutions will present “Introduction to Sintering Products” at the Step-by-Step Technical Conference on Thursday, November 5th, 2020 in Hangzhou, China.
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News_VF TH 300_Product Release_2Sep2021
Circuitry
Press Release
Product Launch - MacuSpec VF-TH 300 V-Pitting Resistant Pattern Plating Metallization for Advanced HDI PCBs
MacDermid Alpha Electronics Solutions announces the release of MacuSpec VF-TH 300, a new addition to the award-winning VF-TH series electroplating processes widely utilized in mSAP HDI manufacturing.
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China Powertrain
Assembly
Press Release
Power Electronics Solutions Featured at China Powertrain Electrification and Innovation Summit
The Assembly Division of MacDermid Alpha Electronics Solutions will present the paper, “Alpha Power Electronics Solutions” at the 3rd China Powertrain Electrification and Innovation Summit 2020 – New Energy Vehicle 2.0 Era from October 22-23, 2020 in Shanghai, China.
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PCB101 The Basics of Printed Circuit Board Fabrication Webinar
Circuitry
Press Release
Hosting a Series of Online Webinars: PCB101 The Basics of Printed Circuit Board Fabrication
MacDermid Alpha Electronics Solutions will be hosting a series of free webinars covering the basics of building a printed circuit board. The series will begin Tuesday, October 27, 2020 1:00 – 3:00pm EST and will run every Tuesday until November 17.
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News_TPCA Taipei 20_31Aug2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Exhibiting at TPCA and Presenting at IMPACT-EMAP 2020 Conference
MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and presenting two technical papers at the IMPACT-EMAP Conference, co-located with TPCA in Taipei, October 21-23, 2020. The papers detail some of the ways in which MacDermid Alpha has invested in the research of innovative manufacturing processes to meet the demanding standards required for the new age of miniaturization.
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News_Semicon Taiwan 20_31Aug2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Recent Product Launches Exhibited and Promoted at Semicon Taiwan
MacDermid Alpha Electronics Solutions will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.
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