News & Events

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MacdermidAlpha-Market
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News_EPP Innovations Forum 20_2Sep2021
Assembly
Press Release
Latest Silver Sinter Technology Presented at the EPP Innovations Forum
The Assembly Solutions Division of MacDermid Alpha Electronics Solutions will present on the Silver Sintering Process at the EPP Innovations Forum on Thursday 5th March in Böblingen, Germany.
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News_iMAPS_31Aug2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
MacDermid Alpha to Exhibit and Present at the Upcoming IMAPS Device Packaging Conference
MacDermid Alpha Electronics Solutions will exhibit total process solutions for emerging packaging at the IMAPS Conference, Fountain Hills, AZ, March 3-5, 2020.
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Stephen Cooper, Reginal Sales Director – Western Europe at MacDermid Alpha, and Richard Jones, Managing Director of AMS
Assembly
Press Release
MacDermid Alpha Announces New Distribution Partnership for the UK and Ireland
The Assembly Division of MacDermid Alpha Electronics Solutions is excited to announce a new distribution partnership with Advanced Manufacturing Services Limited (AMS) for the sale and distribution of Alpha brand products in the United Kingdom and Ireland, effective 1st April 2020.
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News_APEX 2020 OM 550_31Aug2021
Assembly
Press Release
ALPHA® OM-550 Solder Paste to be Demonstrated by Vermes Microdispensing at IPC APEX Conference & Expo 2020
MacDermid Alpha Electronics Solution will have its revolutionary low temperature solder paste, ALPHA OM-550 HRL1 demonstrated by Vermes Microdispensing on their latest solder paste jetting dispense system, MDS 1560 with DST(Dynamic Shockwave Technology), during this year’s IPC APEX Conference and Expo, February 1-6, in San Diego, California.
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News_StayDry Z20_Product Release_2Sep2021
Semiconductor
Press Release
Product Launch - STAYDRY® Z20: Moisture Getter Film
MacDermid Alpha Electronics Solutions announces the release of STAYDRY® Z20 – Moisture Getter for hermetic packages. STAYDRY Z20 is a silicone film moisture getter with a newly developed proprietary backing adhesive that meets rigid outgassing and adhesion testing for aerospace, telecom and medical applications, meeting MIL-STD-883K, Method 5011.6.
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News_Enklad_Product Release_2Sep2021
Circuitry
Press Release
Product Launch - First Processes in New Memory Disk Product Line: Enklad Pretreatment
MacDermid Alpha Electronics Solutions announces the release of Enklad Pretreatment, a process to clean and zincate aluminum memory disk substrates. When used to prepare aluminum surfaces for electroless nickel plating, Enklad Pretreatment provides a major upgrade in process quality, deposit uniformity, and functional capability.
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News_APEX 2020 OM 550_31Aug2021
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Kester Integration to be Highlighted at IPC APEX EXPO 2020 – Product Focus on Affinity ENIG and HiTech Adhesives/Encapsulants
MacDermid Alpha Electronics Solutions will feature Affinity 2.0, their highly stable, low corrosion ENIG process and the ALPHA® HiTech™ portfolio of low temperature adhesives, encapsulants, and underfills, at the IPC APEX Conference and Expo, February 1-6, in San Diego, California.
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