News & Events

The Assembly Division of MacDermid Alpha Electronics Solutions will exhibit at the SMTA Empire Expo & Tech Forum on Tuesday, September 28th at the RIT Inn & Conference Center in Henrietta, New York.

The Assembly Division of MacDermid Alpha Electronics Solutions has celebrated 25 years of partnership with Lenz SP.j, its distributor of ALPHA brand products in Poland.

MacDermid Alpha Electronics Solutions and electronics assembly announces the release of MICROFAB EVF NiBAR, a boric acid free sulfamate nickel electroplating process for semiconductor applications.

MacDermid Alpha Electronics Solutions will be exhibiting at the China International Electronics Circuit Exhibition hosted by the China Printed Circuit Association. The show will be held from July 7-9, 2021 at the National Exhibition and Convention Center in Shanghai.

MacDermid Alpha Electronics Solutions, a leading global supplier of specialty chemicals and materials used in the semiconductor fabrication, semiconductor packaging, and printed circuit board fabrication and assembly markets announced today that it has acquired H.K. Wentworth Group, owner of the Electrolube & AF brands.

The Assembly Division of MacDermid Alpha Electronics Solutions will present three technical papers: “High-Reliability, Fourth Generation Low-Temperature Solders: Improving Drop Shock Performance”, “Can Low Cost Silver-Free Alloys Be Used in Type II and III Assemblies?” and “Can All Liquid Fluxes Work Well on A Reflowed OSP Pad Finish?” at the SMTA China East Technical Conference taking place from April 21-22 in Shanghai, China.

(West Haven, Connecticut, USA) – MacDermid Alpha Electronics Solutions, a global leader in high performance electronics materials, officially opened a Greater China Die Attach Application Center on April 1st, 2021. The advanced technology and application center will house technical service and lab personnel, equipped with state-of-the-art die attach assembly and process equipment.

MacDermid Alpha Electronics Solutions will be a Supporting Partner at the upcoming IMAPS Device Packaging Conference being held virtually from April 12-15, 2021. MacDermid Alpha will highlight their entire portfolio of technologies from their MacDermid Enthone, Alpha, Kester, and Compugraphics brands essential to advanced semiconductor packaging and the markets it enables.

The Assembly Solutions division will introduce ALPHA OM-372 its latest ultra-fine feature solder paste innovation at Productronica China at the Shanghai New International Expo Centre in Shanghai, China from March 17-19.

MacDermid Alpha Electronics Solutions will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.

MacDermid Alpha Electronics Solutions announces the release of STAYDRY® H2-3000PSA, a hydrogen and moisture getter for hermetic packages. STAYDRY H2-3000PSA adds a newly developed proprietary adhesive that meets rigid outgassing and adhesion testing for aerospace, telecom and medical applications, meeting Mil-STD-883K, Method 5011.6 and NASA ASTM E595 requirements.

MacDermid Alpha Electronics Solutions will be exhibiting at the International Electronics Circuit Exhibition hosted by the Hong Kong Printed Circuit Association. The show will be held from December 2-4, 2020 at the Shenzhen Convention and Exhibition Center, China.