News & Events

MacDermid Alpha Electronics Solutions announces the release of Systek ETS 1200, the latest addition to the Systek family of IC Substrate manufacturing solutions.

MacDermid Alpha Electronics Solutions announces the release of Systek UVF 100, the newest release in the Systek family of IC Substrate manufacturing solutions.

The Assembly Solutions Division of MacDermid Alpha Electronics Solutions will introduce its new ultra-low temperature solder and 5G solutions at the Productronica China show from July 3-5, 2020, at the National Exhibition and Convention Center in Shanghai.

MacDermid Alpha Electronics Solutions announces the release of Systek SAP.

MacDermid Alpha Electronics Solutions will participate in two online panel discussions on Tuesday 2nd June; Recent Advances in Low Temperature Solders hosted by Global SMT & Packaging, and the SMT Printing Round Table hosted by the Surface Mount Technology Association (SMTA).

MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces Rick Fricke will be joining MacDermid Alpha Electronic Solutions (MAES) as the Vice President and General Manager of their Semiconductor Solutions division.

MacDermid Alpha Electronics Solutions will exhibit total process solutions for emerging packaging at the IMAPS Conference, Fountain Hills, AZ, March 3-5, 2020.

MacDermid Alpha Electronics Solutions announces the release of Enklad Pretreatment, a process to clean and zincate aluminum memory disk substrates. When used to prepare aluminum surfaces for electroless nickel plating, Enklad Pretreatment provides a major upgrade in process quality, deposit uniformity, and functional capability.

MacDermid Alpha Electronics Solutions will feature Affinity 2.0, their highly stable, low corrosion ENIG process and the ALPHA® HiTech™ portfolio of low temperature adhesives, encapsulants, and underfills, at the IPC APEX Conference and Expo, February 1-6, in San Diego, California.