SMTA International

Minneapolis Convention Center

Minneapolis, MN
United States
Trade Show
MacDermid Alpha will present five technical papers during the SMTA International Conference. The latest solutions from the Alpha, Electrolube, Kester, and MacDermid Enthone brands of MacDermid Alpha Electronics Solutions will be on exhibit at Booth 1018.
SMTA international tradeshow promotion

Five papers discussing a range of solutions and materials designed to meet the demands of critical applications within automotive, telecommunication, and high-power LED assemblies will be presented by MacDermid Alpha experts during the SMTAi Conference. The titles of the technical papers scheduled for presentation are as follows:

  • Next Generation High Reliability Solder for Automotive Applications, Pritha Choudhury, Tuesday, November 1, 8:30 AM 
  • Direct Metallization for the Printed Circuit Boards Manufacturing, Leslie Kim, Thursday, November 3, 8:00 AM
  • Expandable Bio-based Polymers: A Lightweight Future for Electronics Ruggedization, Beth Turner, Thursday, November 3, 11:00 AM
  • Reliability performance of fourth generation low temperature solder alloys in homogeneous and hybrid solder joints, Morgana Ribas, Thursday, Nov 3, 1:30 PM
  • Process and Chemical Reliability Requirements in Matching Reinforcement Materials with Solder Paste Flux Residue, Westin Bent, Thursday, November 3, 3:30 PM

In addition, MacDermid Alpha will promote its innovative portfolio of metallization and electronics assembly technologies in Booth 1018. Featured products include the Electrolube and HiTech brands of polymer solutions engineered to meet the requirements for high reliability and protection for increasingly complex circuit boards, coupled with the drive towards miniaturization. MacDermid Alpha will also showcase its latest development in the Alpha brand of solder paste technology, ALPHA OM-565 HRL3, a low temperature solder paste which enhances electro-chemical performance over and above existing low melt point solders. This paste enables a reduction in peak reflow down to 175°C in order to mitigate common warpage induced defects such as Head-in-Pillow and Non-Wet-Open to improve assembly yields.