MacDermid Alpha Electronics Solutions to showcase at SMTA Electronics in Harsh Environments Conference

Technical University of Denmark

2800 Kgs
Our MacDermid Alpha's experts will introduce four compelling presentations focused on enhancing board level reliability in power electronics and harsh environments.

We will be presenting our latest research through four technical sessions. Our dedicated team will be exhibiting, providing insights, and addressing questions about our innovative solutions designed for optimal performance in the most demanding applications. Connect with our experts at the following presentations below:


Tuesday, May 14th

Supriya Devarajan, Principal R&D Scientist, is presenting: "Optimizing Material Selection for High-Reliability 3D In-Mold HMI Structures" at 11:00 AM

Human Machine Interfaces (HMIs) in consumer and automotive electronics are evolving rapidly. This progression involves the integration of screen-printed, flexible electronic circuits, assembled electronic components, and displays made of transparent conductive films into thermoformed and injection molded structures. As technology advances and consumer preferences evolve, the importance of this integration is poised for further growth.

Within this framework, the reliability of conductive silver inks for In-Mold Electronics (IME) and flexible circuits plays a pivotal role. Supriya's presentation will delve into how these inks undergo rigorous testing under harsh environmental conditions to ensure their stability and suitability for real-world applications, thus contributing to the seamless operation and reliability of advanced HMI systems. 

Wednesday, May 15th

Anna Lifton, Director of R&D Applications, is presenting: "Electrochemical Reliability Considerations of Board Level Assembly Solder Joints with Polymer Reinforcement Materials Used with Advanced Semiconductor Packaging" at 11:00 AM.

As advanced semiconductor packages become more complex, they pose unique challenges for board level reliability (BLR). This complexity underscores the critical importance of carefully selecting reinforcement materials. The goal is to improve BLR without compromising the electrochemical reliability of the entire assembly.  

Discover strategies to enhance thermomechanical performance while maintaining electrochemical reliability.  


Chris Klok, Director of Electric Vehicle Technology, is presenting: "Hardware Reliability Challenges for EV Power Electronics - Why Materials Matter" at 3:15 PM.

As vehicle electrification rapidly advances, the reliance on more efficient power electronics intensifies. The drive towards greater efficiency comes with the challenge of producing highly reliable hardware on multiple fronts. This necessity emphasizes the importance of thermal resistance in power electronics, a concept relatively new to the automotive sector. The demand for increased current density required to make systems smaller, further adds to the complexity of thermal management, underscoring the necessity for innovative solutions in this dynamic environment.


Thursday, May 16th

Phil Kinner, Global Technical Director, is presenting: "Conformal Coating Protection vs. Flower of Sulfur Testing; The Natural Evolution of Surface Insulation Resistance Testing" at 3:15 PM.

With the increasing density of electronic components, particularly with controllers and sensors in high-stress environments, the need for robust protection measures grows. The use of conformal coating is becoming more essential to protect the assembly from its operating environment and ensure reliable performance in harsh conditions. The emergence of sulfide “creep” corrosion as a significant factor underscores the necessity for advanced protection solutions.  

Our exploratory paper breaks new ground by presenting early data from Surface Insulation Resistance (SIR) testing in a Flowers of Sulfur (FoS) environment. This innovative approach provides an alternative viewpoint on evaluating coating effectiveness. Learn more about safeguarding your devices beyond the traditional high temperature, high humidity environments.