Explore Technical Publications Documents

Measuring Copper Surface Roughness for High Speed Applications

IPC APEX 2015

No Bleed Die Attach to Roughened Lead frame
Optimization of Die Attach to Surface-Enhanced Leadframes for MSL-1 Performance for QFN Packages (Part 1)

Chip Scale Review 2017

Optimization of Die Attach to Surface-Enhanced Leadframes for MSL-1 Performance for QFN Packages (Part 2)

Chip Scale Review 2017

Optimized Semi-Additive Process for Polyimide as Dielectric in Build Up Packages

IPC APEX 2015

Optimizing Morphology of Plated Copper Sub Assemblies Through Oxide Alternative Process

ECWC 2013

PCB Surface Finishes: A General Review

SMTNet 2015

Periodic Pulse Plating of Mid-Aspect Ratio Printed Circuit Boards for Enhanced Productivity

SMTA International 2019

Pilot Production of High Efficient Metal Catalyzed Textured Diamond Wire Sawed mc-Si Solar Cells Combined with Nickel-Copper Plated Front Contact Processing

EU PVSEC 2017

Pit Resistant Acid Copper Electroplating Process for Flash Etching

SMTA International 2020

Process Improve Strategies for Weak MicroVia Interface

IPC APEX 2021

Quantitative Analysis of Corrosion Resistance for Electroless Ni-P Plating

IPC APEX 2013

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