Brochures & Sales Sheets

Electrolytic Copper Metallization

Simultaneous Via Filling and Through Hole Plating Copper Metallization

Simultaneous Via Filling and Through Hole Plating Copper Metallization

Copper Conductors - Printed and Plated

Key Issues and Preferred Processes

The microvia structure has enabled circuit miniaturization for decades and continues to be the single most important interface in the electronic design. As reliability becomes increasingly important, the ability of these structures to hold up during the stresses of assembly and during end use is under extreme scrutiny.

Plating Solutions for Molded Interconnect Devices

modified Semi-Additive Process

Innerlayer Bonding System

Copper Adhesion Promoter

Copper Adhesion Promoter

Immersion Tin