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Product Overview
ALPHA OM-565 HRL3 low temperature solder paste is designed to mitigate warpage induced defects in temperature sensitive chip-scale packages. The solder paste enables peak reflow temperatures of 175 °C and superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HIP).
The ALPHA OM-565 chemistry enhances electrochemical performance over existing low melt point solders and provides excellent compatibility when used in combination with alternative ALPHA solutions for contact rework applications.
Product Features
- Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability.
- The HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects.
- Low melt point reflow improves energy efficiency and reduces energy costs in the assembly process.
- Superior HiP/NWO performance.
- Compatibility with contact rework applications.
- 8-hour stencil life in ambient and elevated conditions.
Minimizes Warpage Induced Defects to Maximize Assembly Yield
Next generation devices require a larger footprint and thinner form factor design that deliver superior processing power over existing technologies. These next generation packages create challenges for assembly at traditional SMT reflow temperatures. ALPHA OM-565 HRL3 enables a reduction in peak reflow down to 175 °C to mitigate common warpage induced defects such as HiP and NWO to improve assembly yields.
HRL3 Alloy Improves Reliability Over Existing Low Temperature Solutions
ALPHA OM-565 HRL3 microalloying additions continue to enhance the mechanical reliability over existing best-in-class low temperature solutions. The resulting ductility of the HRL3 alloy and superior wettability of the ALPHA OM-565 chemistry further advances the drop shock performance of low melt point alloys.
Enhances the Environmental Sustainability of the Assembly Process
The HRL3 alloy offers a significant reduction in peak reflow temperature over existing SAC reflow conditions. The ability to reliably solder at 175 °C peak temperatures will increase the efficiency of existing assembly processes while lowering the manufacturers net impact on its surrounding environment.
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