Product Overview

ALPHA Argomax 9500 Sinter Preforms were developed to provide a dry placement sinter solution. 

These Innovative sinter preforms deliver superior thermal conductivity, excellent electrical conductivity.

Applications include substrate attach, spacer attach, module attach, and package attach.

Preforms ease assembly implementation with automated pick and place from tape and reel packaging.

SinteReady products eliminate the need for printing/dispensing and drying processes, improving process throughput.


 

Product Features

  • Ready to sinter dry placement interconnect compatible with Copper metallization surfaces
  • Target total bondline range of 50-250µm​
  • Customer defined dimensions​
  • Low sinter pressure, low sinter temperature 
  • Fast sinter time for high yield manufacturing​
  • Tape and reel packaging
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ALPHA Argomax Power Electronics Brochure English

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ALPHA Argomax 功率电子 宣传册 简体中文

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ALPHA Argomax 9500 Sinter Preforms for Cu Substrate Attach

9500 Series ALPHA Argomax Sinter Preforms are compatible with Cu surfaces, such as bare copper substrates, and can be used to provide a dry placement solution for the interconnection between clip and substrate.  

 

Key Factors for SinteReady™ Products

  • No printing / dispensing or drying time compared to sinter paste
  • Repeatable bondlines based on ALPHA Argomax film
  • Machine handling for fast, repeatable assembly

Product Type

Product Name

Compatible Surface Finish

Product Application Method

End Application

Engineered Sinter Product

ALPHA Argomax 9200 Sinter Preforms

Ag, Au

Pick & Place

Die Top Attach, Package/Module Attach, Substrate Attach, Spacer Attach

Engineered Sinter Product

ALPHA Argomax 6100 Laminated Clips

Ag, Au, Cu

Pick & Place

Die Top Attach

Engineered Sinter Product

ALPHA Argomax 6500 Bond Pad

Ag, Au, Cu

Pick & Place

Die Top Attach

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