ALPHA HiTech CF12-4485B end market is in portables such as Graphic Cards, Notebooks, Tablets, as well as assembled boards in Automotive and Medical accessories.
It can be stored in non-freezing condition of 1 - 10°C.
- A lower cost option to conventional underfilling process with increased productivity and lower material volume required
- Long Pot Life of 7 days
- Excellent Adhesion on FR4
- Halogen-free and complies with RoHS Directive 2015/863/EU
Non-freezing, low shipment cost Edgebond
Dry Ice shipment is a costly process. For applications not requiring high temperature exposurem ALPHA HiTech CF12-4485B is an effective edgebond for consideration, if so adopted only requires 1 - 10°C storage condition. It has been tested to pass 1500 cycles protecting SAC305 solder joints in BGA assembly subjected to -40 +125°C Thermal Cycling test. Standalone solder joints can only survive 600 cycles under this same condition.