Product Overview

ALPHA HiTech CF12-4485B end market is in portables such as Graphic Cards, Notebooks, Tablets, as well as assembled boards in Automotive and Medical accessories.

It can be stored in non-freezing condition of 1 - 10°C. 





Product Features

  • A lower cost option to conventional underfilling process with increased productivity and lower material volume required
  • Long Pot Life of 7 days
  • Excellent Adhesion on FR4
  • Halogen-free and complies with RoHS Directive 2015/863/EU
Technical Bulletins
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ALPHA HiTech CF12-4485B Edgebond Technical Bulletin English

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ALPHA HiTech Brochure English

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ALPHA HiTech 宣传册 简体中文

ALPHA HiTech CF12-4485B

Non-freezing, low shipment cost Edgebond

Dry Ice shipment is a costly process.  For applications not requiring high temperature exposurem  ALPHA HiTech CF12-4485B is an effective edgebond  for consideration, if so adopted only requires 1 - 10°C storage condition.  It has been tested to pass 1500 cycles protecting SAC305 solder joints in BGA  assembly subjected to -40 +125°C Thermal Cycling test.  Standalone solder joints can only survive 600 cycles under this same condition.

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