Flyers

A lead-free, zero-halogen, no-clean, multi-alloy capable solder paste designed for high reliability applications where electrochemical reliability and excellent pin testability is required.  

Una soldadura en pasta que no necesita limpiarse, sin plomo y con cero halógenos que además es compatible con diversas aleaciones y está diseñada para aplicaciones de alta confiabilidad, donde se requiere de confiabilidad electroquímica y excelente capacidad para las pruebas de pines. 

A lead-free, zero-halogen, no-clean solder paste designed to provide advanced electrochemical reliability in harsh operating conditions on fine pitched component packages.

一款无铅、免清洗 、 完全不含卤素锡膏，旨在恶劣的工作条件下并在细间距组件上实现的电化学可靠性。

一款无铅、完全不含卤素、免清洗焊膏。专为需要高电化学可靠性和针测性能的高可靠性应用而设计。 

The highest activity of any VOC-free Bellcore SIR compliant flux for defect-free soldering.

在所有能满足Bellcore表面绝缘阻抗（SIR）和无有机挥发物要求的助焊剂当中，ALPHA EF-2100具备最高活性，能实现无缺陷焊接。

An active, rosin-free, low solid, low residue liquid flux, specifically developed to deliver outstanding board cosmetics and to eliminate the tendency for solder balling and solder bridging, which are normally associated with rosin-free chemistries.

Halide free, low solids, alcohol based, no-clean wave soldering fluxes. 

Alcohol-based fluxes designed for both standard and thicker, high-density PCBs in Lead-free processes.

an alcohol based flux designed for both standard and thicker, high-density PCBs in Lead-free processes.

Bond chip components or devices at varying curing conditions.