Search
Header
Our divisions
Our deep connections to all areas of the electronics supply chain are a crucial element in our customers’ success.
Circuitry Solutions
Specialty chemical solutions for the most complex printed circuit board and IC substrate designs.
Image
Semiconductor Solutions
Advanced interconnect metallization and assembly materials used in leading-edge chip fabrication and wafer-level packaging.
Image
Assembly Solutions
High performance component attachment materials for the assembly of printed circuit boards and power electronics applications.
Image
Our Brands
Our Brands
Image
Image
Image
Image
Image
Featured Content
Image
Image
Featured News & Events
Low Temperature Solder Solutions for Defect-free Next Generation Package Designs
Image
United States
Webinar/Online
Assembly
Webinar May 25 at 2 pm EST. Low temperature solder solutions have been gaining interest in recent years as a technology enabler for next generation chip-scale package designs. Recent alloying advancements led to the development of the HRL3 alloy that significantly improves reliability over traditional tin-bismuth (SnBi)-based low temperature solder alloys.
MacDermid Alpha Webinar: “The Critical Role of Getters in Hermetic Packages”
Image
United States
Webinar/Online
Circuitry
Semiconductor
Michael Previti will be presenting “The Critical Role of Getters in Hermetic Packages”.
SMTA China East Technology Conference 2022
Image
China
Conference
Assembly
MAES will be giving presentations at the SMTA China East Technology Conference 2022 which focuses on the electronics engineering and manufacturing aspects.
Low Temperature Solder Solutions for Defect-free Next Generation Package Designs
Image
United States
Webinar/Online
Assembly
Webinar May 25 at 2 pm EST. Low temperature solder solutions have been gaining interest in recent years as a technology enabler for next generation chip-scale package designs. Recent alloying advancements led to the development of the HRL3 alloy that significantly improves reliability over traditional tin-bismuth (SnBi)-based low temperature solder alloys.
MacDermid Alpha Webinar: “The Critical Role of Getters in Hermetic Packages”
Image
United States
Webinar/Online
Circuitry
Semiconductor
Michael Previti will be presenting “The Critical Role of Getters in Hermetic Packages”.
SMTA China East Technology Conference 2022
Image
China
Conference
Assembly
MAES will be giving presentations at the SMTA China East Technology Conference 2022 which focuses on the electronics engineering and manufacturing aspects.
What do you need solved?
Let our experts find your solution.
Let our experts find your solution.