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Our divisions
Our deep connections to all areas of the electronics supply chain are a crucial element in our customers’ success.
Circuitry Solutions
Specialty chemical solutions for the most complex printed circuit board and IC substrate designs.

Semiconductor Solutions
Advanced interconnect metallization and assembly materials used in leading-edge chip fabrication and wafer-level packaging.

Assembly Solutions
High performance component attachment materials for the assembly of printed circuit boards and power electronics applications.

Our Brands
Our Brands





Featured Content


Featured News & Events
CPCA 2023

China
Trade Show
Circuitry
MacDermid Alpha Electronics Solutions will be exhibiting at CPCA 2023 in Shanghai, China.
Productronica China 2023

China
Trade Show
Assembly
Semiconductor
MacDermid Alpha Electronics Solutions will be presenting their latest integrated solutions for circuit board and semiconductor assembly at Productronica China Booth #4528 Hall N4, Longyang Road, Pudong New District 201204 Shanghai China.
Plastic Films in Mobility / Folien + Fahrzeug Conference

Germany
Conference
Assembly
MacDermid Alpha is a proud sponsor and participant at this year’s Plastic Films in Mobility (Folien + Fahrzeug) conference. The event is dedicated to design and technology trends in automotive interior and exteriors with smart electronics integration and innovative decoration technologies.
CPCA 2023

China
Trade Show
Circuitry
MacDermid Alpha Electronics Solutions will be exhibiting at CPCA 2023 in Shanghai, China.
Productronica China 2023

China
Trade Show
Assembly
Semiconductor
MacDermid Alpha Electronics Solutions will be presenting their latest integrated solutions for circuit board and semiconductor assembly at Productronica China Booth #4528 Hall N4, Longyang Road, Pudong New District 201204 Shanghai China.
Plastic Films in Mobility / Folien + Fahrzeug Conference

Germany
Conference
Assembly
MacDermid Alpha is a proud sponsor and participant at this year’s Plastic Films in Mobility (Folien + Fahrzeug) conference. The event is dedicated to design and technology trends in automotive interior and exteriors with smart electronics integration and innovative decoration technologies.