High Reliability Preform Solutions to be Featured at Austin SMTA Expo & Tech Forum

ALPHA® Exactalloy® Tape and Reel Preforms for high reliability applications will be one of the featured solutions.  With electrical components sizes becoming ever smaller, printing sufficient amounts of solder paste onto miniaturized, overpopulated PCBs has become increasingly challenging. ALPHA Exactalloy Tape and Reel Preforms are specifically designed to overcome these solder volume deficiencies, enhancing the solder joint strength and reliability and providing 100% hole fill.

“ALPHA Exactalloy Tape and Reel Preforms continue to be the go-to solution for solving solder deficiencies experienced in surface mount assemblies. Our customers benefit from the ease of implementation and the instantaneous results for solving solder deficiencies for both surface mount and through-hole components, often eliminating rework,” states Jerry Sidone, Product Manager, Preforms. “Our low temperature lead-free alloy offering (140 °C) makes ALPHA Exactalloy Tape and Reel Preforms the natural choice for secondary soldering applications of temperature sensitive components and the next generation of low temperature assembly applications.”

Additional solutions to be promoted include the latest Alpha and Kester low temperature and high reliability solder pastes and the adhesive, edgebond, and underfill capabilities of the ALPHA HiTech polymer solutions portfolio of products.

Visit the Assembly Solutions landing page or more details on these and other innovative assembly materials.